Method of forming embedded copper interconnections and embedded copper interconnection structure
AssigneeEbara Corporation
InventorsNaoaki Ogure, Hiroaki Inoue
Life of this patent
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Abstract
Embedded interconnections of copper are formed by forming an insulating layer, forming embedded interconnections of copper in the insulating layer, making an exposed upper surface of the insulating layer and an exposed surface of the embedded interconnections of copper coplanar according to chemical mechanical polishing, and forming a protective silver film on the exposed surface of the embedded interconnections of copper. These steps are repeated on the existing insulating layer thereby to produce multiple layers of embedded interconnections of copper. The exposed surface of the embedded interconnections of copper is plated with silver according to immersion plating.
Claims11
A method of forming a layer of embedded interconnections of copper, comprising:
- forming an insulating layer;
- forming embedded interconnections of copper in the insulating layer;
- planarizing an exposed surface of the insulating layer including an exposed surface of the embedded interconnections of copper;
- and
- forming a film of silver on the exposed surface of the embedded interconnections of copper by plating.
A method of forming embedded interconnections of copper on a substrate, said method comprising:
- forming an insulating layer on the substrate;
- forming embedded interconnections of copper in the insulating layer;
- planarizing an exposed surface of the insulating layer including an exposed surface of the embedded interconnections of copper;
- and
- immersion plating the planarized surface of the embedded interconnections of copper to form a protective film on the planarized surface of the embedded interconnections of copper, said immersion plating comprising dipping the substrate including the insulating layer and the embedded interconnections of copper into an aqueous solution of silver cyanide so as to plate only the exposed surface of the embedded interconnections of copper.
A method of forming embedded interconnections of copper on a substrate, said method comprising:
- forming an insulating layer on the substrate;
- forming embedded interconnections of copper in the insulating layer;
- planarizing an exposed surface of the insulating layer including an exposed surface of the embedded interconnections of copper;
- and
- plating the planarized surface of the embedded interconnections of copper to form a protective silver film on the planarized surface of the embedded interconnections of copper.
A method of forming embedded interconnections of copper on a substrate, said method comprising:
- forming a first layer on the substrate, including:
- forming a first insulating layer on the substrate;
- forming embedded interconnections of copper in the first insulating layer;
- planarizing an exposed surface of the first insulating layer including an exposed surface of the embedded interconnections of copper;
- and
- immersion plating the planarized surface of the embedded interconnections of copper to form a protective film on the planarized surface of the embedded interconnections of copper, said immersion plating comprising dipping the substrate including the first insulating layer and the embedded interconnections of copper into an aqueous solution of silver cyanide so as to plate only the exposed surface of the embedded interconnections of cooper;
- and
- forming a second layer on the first layer, including forming a second insulating layer on the first layer formed on the substrate.
A method of forming embedded interconnections of copper on a substrate, said method comprising:
- forming a first layer on the substrate, including:
- forming a first insulating layer on the substrate;
- forming embedded interconnections of copper in the first insulating layer;
- planarizing an exposed surface of the first insulating layer including an exposed surface of the embedded interconnections of copper;
- and
- plating the planarized surface of the embedded interconnections of copper to form a protective silver film on the planarized surface of the embedded interconnections of copper;
- and
- forming a second layer on the first layer, including forming a second insulating layer on the first layer formed on the substrate.
Dependencies are inferred from the claim text.