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US 6,787,399 B2Granted
Plastic lead frames for semiconductor devices, packages including same, and methods of fabrication
AssigneeMicron Technology, Inc.
InventorsTongbi Jiang, Jerrold L. King
Life of this patent
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Abstract
A conductive plastic lead frame and method of manufacturing the same, suitable for use in IC packaging. In a preferred embodiment, the lead frame is constructed of a plastic or polymer based lead frame structure with an intrinsic conductive polymer coating. In a second embodiment, the lead frame is a composite plastic or polymeric material intermixed with an intrinsic conductive polymer coating.
Claims7
A manufacturing method for forming a plastic lead frame structure for use with at least one semiconductor device comprising:
- providing a source of material for one of an injection molding thereof in an injection molding process, a stamping thereof in a stamping process, and an etching thereof in an etching process;
- forming a plastic lead frame structure from the material;
- and
- coating the plastic lead frame structure with a conductive material.
1 more element
Dependencies are inferred from the claim text.