Structure and method of direct chip attach
AssigneeSemiconductor Components Industries, LLC
InventorGuan Keng Quah
Life of this patent
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Abstract
A semiconductor package (101) has a die (1), a leadframe (4), a bond pad (6), an encapsulation (3) and a wire bond ball (2). The wire bond ball is formed on the bond pad by bonding one end of a bond wire (7), and remainder of the bond wire is removed. Locations (23) for attaching the wire bond ball are recorded with reference to fiducials (5) on the lead frame. The encapsulation covers the die, deposits and die attach flag (24) of the lead frame. The wire bond ball is exposed where the encapsulation is removed. The locations for making openings (17) for exposing the wire bond ball is determined by recorded coordinates when the wire bond ball is formed. Exposed wire bond ball is plated, forming a lead to electrically connect to the die.
Claims11
A method of making a packaged semiconductor device, comprising the steps of:
- providing an encapsulated semiconductor device including a semiconductor die attached to a lead frame, the semiconductor die including a lead attached thereto;
- and
- selectively removing encapsulation material from the encapsulated semiconductor device at a location determined by a point on the lead frame to expose the lead.
Dependencies are inferred from the claim text.