Semiconductor device having pads for connecting a semiconducting element to a mother board
AssigneeMitsubishi Denki Kabushiki Kaisha
InventorsMinoru Oohira, Kenji Ohgiyama, Teruhisa Fujihara
Life of this patent
Estimating the term…
Abstract
Provide a discrete semiconductor device, particularly a discrete semiconductor device for small signal operation with a smaller packaging area and has excellent high frequency characteristics and good heat dissipation performance, and a method for producing the same. The discrete semiconductor elements are mounted on die bond pads and wire bond pads with the packaging surface being sealed with a resin, and connecting the back faces of the die bond pads and the wire bond pads directly to a mother board.
Claims7
A method for producing discrete semiconductor devices, comprising the steps of:
- forming a plurality of sets of die bond pads and wire bond pads with electrically conductive metal sheets at specified positions on the back of an insulating sheet and making apertures in the insulating sheet on the metal sheets,
- packaging the discrete semiconductor elements, said packaging step comprising fastening the back of the discrete semiconductor elements on the die bond pads and electrically connecting the electrodes of the discrete semiconductor elements and the wire bond pads, the die bond pads and the wire bond pads being adopted to be mounted on a motherboard,
- sealing the plurality of discrete semiconductor elements installed on the insulating sheet with an integral sealing resin by sealing the packaging surface of the insulating sheet with the resin, and
- dividing the sealing resin into the discrete semiconductor devices by cutting off the sealing resin around the discrete semiconductor elements.
A method for producing a discrete semiconductor device, comprising the steps of:
- packaging a plurality of discrete semiconductor elements, said packaging step comprising fastening the back of the discrete semiconductor elements onto an electrically conductive metal sheet and connecting electrically an electrode of each discrete semiconductor element to a specified position of the metal sheet,
- sealing the packaging surface of the metal sheet with an integral sealing resin,
- cutting into the metal sheet from the back to turn the metal sheet, on which the discrete semiconductor elements are fastened, into die bond pads and wire bond pads which are arranged at intervals, and
- dividing the discrete semiconductor devices by cutting off the sealing resin around the discrete semiconductor elements.
Dependencies are inferred from the claim text.