Method and system for singulating semiconductor components

A method for singulating semiconductor components contained on a substrate having a plurality of locator openings comprising:

• providing a nest configured to hold the substrate;
• providing an alignment base comprising a plurality of locator pins configured to engage the locator openings;
• placing the substrate on the nest;
• placing the nest on the alignment base and aligning the substrate on the nest using the locator pins wherein the alignment base comprises a plurality of mounting studs configured to engage a plurality mounting openings on the nest;
• providing a sawing base configured to hold the nest and the substrate for sawing;
• removing the nest from the alignment base;
• placing the nest on the sawing base;
• and
• sawing the substrate into separate components.

A method for singulating semiconductor components contained on a substrate having a plurality of locator openings comprising:

• providing an alignment base comprising a plurality of locator pins configured to engage the locator openings;
• providing a nest mountable to the alignment base configured to hold the substrate;
• placing the nest on the alignment base wherein the alignment base comprises a plurality of mounting studs configured to engage a plurality mounting openings on the nest;
• aligning the substrate on the nest using the alignment base and the locator pins;
• providing a sawing base for holding the nest comprising a vacuum opening configured to hold the substrate on the nest;
• removing the nest from the alignment base;
• mounting the nest to the sawing base with the vacuum opening holding the substrate on the nest;
• and
• sawing the substrate into separate components.

A method for singulating semiconductor components contained on a substrate:

• providing the substrate with a plurality of locator openings;
• providing a nest configured to hold the substrate comprising a plurality of openings;
• providing a clamping mechanism attachable to the nest for clamping the substrate to the nest;
• providing an alignment base comprising a plurality of locator pins configured to engage the locator openings;
• placing the nest on the alignment base with the locator pins projecting from the openings in the nest;
• placing the substrate on the nest with the locator pins engaging the locator openings;
• attaching the clamping mechanism to the nest to clamp the substrate to the nest;
• removing the nest from the alignment base;
• providing a sawing base comprising a vacuum opening configured to apply a vacuum to the substrate held on the nest;
• applying the vacuum through the sawing base to the substrate;
• removing the clamping mechanism from the nest;
• and
• sawing the substrate held on the nest by the vacuum into separate components.

A method for singulating semiconductor components contained on a substrate having a plurality of locator openings comprising:

• providing a base comprising a plurality of mounting studs and a nest configured to hold the substrate comprising a plurality of mounting openings;
• providing a clamping mechanism configured to hold the component on the base and a plurality of locator pins on the clamping mechanism configured to engage the locator openings;
• placing the nest on the base and the substrate on the nest with the mounting studs engaging the mounting openings;
• attaching the clamping mechanism to the nest;
• aligning the substrate on the nest during the attaching step using the locator pins;
• providing a sawing base configured to hold the nest and the substrate for sawing;
• removing the nest from the base;
• placing the nest on the sawing base;
• and
• sawing the substrate into separate components.