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US 6,787,374 B2Granted
Semiconductor device manufacturing method and semiconductor device sorting system to be used with the same
AssigneesHitachi, Ltd., Hitachi Tobu Semiconductor, Ltd.
InventorsHisao Yamagata, Katsumi Oya
Life of this patent
Estimating the term…
Abstract
A sorting section can be supplied with parts from plurality of supply sources. A semiconductor device sorting system is provided with a sorting section for sorting good transistors by means of an electric performance test thereof and supply sections adapted to separate the transistor parts that are collectively supplied in a complex into transistors and supply the separated transistors to the sorting section. An appropriate one of the supply sections can be selected corresponding to the supply form of the transistor parts to be separated. A selected supply section can be switched to another depending on the supply form of the transistor parts.
Claims27
A semiconductor device manufacturing method comprising:
- (a) a step of preparing complexes, each having a plurality of sealed elements having a semiconductor pellet and a link member for linking said sealed elements;
- and
- (b) a step of providing a plurality of supply sources corresponding to different types of semiconductor devices and sequentially processing the complexes supplied from any selected one of said plurality of supply sources.
A semiconductor device manufacturing method comprising:
- (a) a step of preparing complexes, each having a plurality of sealed elements having a semiconductor pellet and a link member for linking said sealed elements;
- (b) a step of linking any selected one of a plurality of supply sections corresponding to different types of semiconductor devices to a sorting section capable of liking to one of said plurality of supply sections, and separating said sealed elements of each of the complexes taken in from a supply source corresponding to the selected supply section, said complexes having a form specific to the selected supply section;
- and
- (c) a step of sorting the separated semiconductor devices in said sorting section.
1 more element
A semiconductor device manufacturing method comprising:
- (a) a step of preparing tape-shaped frames of complexes, each having a plurality of sealed elements having a semiconductor pellet and a link member for linking said sealed elements, said plurality of sealed elements of each complex being arranged consecutively at predetermined regular intervals;
- (b) a step of setting a reel carrying said tape-shaped frame wound around it in a supply section, supplying said tape-shaped frame from said reel, and then, separating said sealed elements from said tape-shaped frame in said supply section;
- and
- (c) a step of supplying the separated semiconductor devices from said supply section to a sorting section, and then, sorting said semiconductor devices by means of a performance test in said sorting section.
1 more element
A semiconductor device manufacturing method comprising:
- (a) a step of preparing tape-shaped frames of complexes, each having a plurality of sealed elements having a semiconductor pellet and a link member for linking said sealed elements, said plurality of sealed elements of each complex being arranged consecutively at predetermined regular intervals;
- (b) a step of setting a reel carrying said tape-shaped frame wound around it in a supply section, supplying said tape-shaped frame from said reel, and then, separating said sealed elements from said tape-shaped frame in said supply section;
- (c) a step of aligning the separated semiconductor devices linearly on a straight parts feeder and supplying linearly said aligned semiconductor devices to a sorting section on by one by means of said parts feeder;
- and
- (d) a step of sorting said semiconductor devices by means of a performance test in said sorting section.
2 more elements
A semiconductor device manufacturing method comprising:
- (a) a step of preparing strip-shaped frames of complexes, each having a plurality of sealed elements having a semiconductor pellet and a link member for linking said sealed elements, said plurality of sealed elements of each complex being arranged at predetermined regular intervals;
- (b) a step of supplying said strip-shaped frames to a supply section and cutting and separating said sealed elements;
- (c) a step of aligning said cut and separated semiconductor devices on a straight parts feeder and supplying said straightly aligned semiconductor devices to a sorting section one by one by means of said parts feeder;
- and
- (d) a step of sorting said semiconductor devices by means of a performance test in said sorting section.
2 more elements
A semiconductor device manufacturing method comprising:
- (a) a step of preparing ring members, each supporting an adhesive tape to which a plurality of sealed elements having respective a semiconductor pellet are bonded;
- (b) a step of supplying said ring member to a supply section, and then, separating said sealed elements from said adhesive tape of said ring member;
- and
- (c) a step of supplying said semiconductor devices separated from said adhesive tape from said supply section to a sorting section, and then, sorting said semiconductor devices by means of a performance test in said sorting section.
1 more element
A semiconductor device manufacturing method comprising:
- (a) a step of preparing ring members, each supporting an adhesive tape to which a plurality of sealed elements having respective a semiconductor pellet are bonded;
- (b) a step of supplying said ring member to a supply section, and then, separating said sealed elements from said adhesive tape of said ring member;
- and
- (c) a step of aligning said semiconductor devices separated from said adhesive tape on a straight parts feeder, and supplying said straightly aligned semiconductor devices to a sorting section one by one by means of said parts feeder;
- and
- (d) a step of sorting said semiconductor devices by means of a performance test in said sorting section.
3 more elements
A semiconductor device manufacturing method comprising:
- (a) a step of preparing a plurality of complexes, each having a plurality of sealed elements having a semiconductor pellet and a link member for linking said sealed elements;
- (b) a step of linking any selected one of a plurality of supply sections corresponding to different types of semiconductor devices to a sorting section capable of linking to one of said plurality of supply sections, and separating said sealed elements of each of the complexes taken in from a supply source corresponding to the selected supply section, said complexes having a form specific to the selected supply section;
- and
- (c) a step of sorting the separated semiconductor devices in said sorting section, said sorting section having a processing capacity smaller than the supplying capacity of said supply section.
1 more element
A semiconductor device manufacturing method comprising:
- (a) a step of preparing a plurality of complexes, each having a plurality of sealed elements having a semiconductor pellet and a link member for linking said sealed elements;
- (b) a step of linking any selected one of a plurality of supply sections corresponding to different types of semiconductor devices to a sorting section capable of linking to one of said plurality of supply sections, and separating said sealed elements of each of the complexes taken in from a supply source corresponding to the selected supply section, said complexes having a form specific to the selected supply section;
- and
- (c) a step of aligning said separated semiconductor devices on a straight parts feeder, detecting the amount of semiconductor devices arranged on said parts feeder by means of a sensor arranged at said parts feeder, and supplying said straightly aligned semiconductor devices to a sorting section one by one by means of said parts feeder, while controlling the rate of supplying semiconductor devices from said supply section by feeding back the information obtained by said detecting operation to said supply section;
- and
- (d) a step of sorting said semiconductor devices by means of a performance test in said sorting section.
3 more elements
Dependencies are inferred from the claim text.