US 6,787,339 B1 · Microfluidic devices having embedded metal conductors and methods of fabricating said devices

Abstract

The present invention provides low cost microfluidic devices having embedded metal conductors. The devices of the invention comprise a electronic component comprising a substrate having a first surface, a layer of electrically-conductive material deposited on a portion of the first substrate surface, a first sublayer of electrically-insulating material deposited on the first substrate surface and on the layer of electrically-conductive material, a second sublayer of electrically-insulating material deposited on the first sublayer of insulating material, and a third sublayer of electrically-insulating material deposited on the layer of dielectric material, and a fluid-handling component having a contoured surface affixed to the electronic component. The devices of the invention are advantageously used for performing electric field lysis and the polymerase chain reaction. The invention further advantageously provides simple, low cost methods for fabricating such microfluidic devices.

Claims37

Dependent claims

A microfluidic device comprising:

(a) an electronic component comprising a substrate having a surface, a layer of electrically-conductive material deposited on a portion of the substrate surface, and a layer of insulating material deposited on the layer of electrically-conductive material and the substrate surface, wherein the layer of insulating material has a substantially planar surface opposite the substrate surface;
and
(b) a fluid-handling component having a contoured first surface and a second surface opposite the contoured first surface, wherein the contoured first surface of the fluid-handling component is affixed to the layer of insulating material on the electronic component, thereby forming one or a plurality of cavities between the electronic component and the fluid-handling component, and wherein the electrically-conductive material is in electrical or thermal communication with said cavities formed between the electronic component and the fluid handing component.

A process for fabricating a microfluidic device comprising the steps of:

(a) generating a pattern for depositing a electrically-conductive material on a surface of a substrate of a electronic component;
(b) depositing a layer of electrically-conductive material on a portion of the substrate surface defined by the generated pattern;
(c) depositing a first sublayer of insulating material on the substrate surface and the layer of electrically-conductive material;
(d) depositing a second sublayer of insulating material on the first layer of insulating material;
(e) depositing a third sublayer of insulating material on the second sublayer of insulating material;
(f) generating a pattern for depositing a material for an electrode on the third sublayer of insulating material;
(g) removing the portion of the third electrically-insulating sublayer, the second electrically-insulating sublayer and the first electrically-insulating sublayer covered by the pattern for depositing the electrode material, thereby forming a trench extending through the third electrically-insulating sublayer, the second electrically-insulating sublayer and the first electrically-insulating sublayer and exposing the layer of electrically-conductive material;
(h) depositing a layer of electrode material in the trench, thereby forming a electronic component comprising the substrate, the layer of electrically-conductive metal material the first sublayer of insulating material, the second sublayer of insulating material, the third sublayer of insulating material, and the electrode;
(i) fabricating a fluid-handling component having a contoured first surface and a second surface opposite the contoured first surface;
and
(j) affixing the contoured first surface of the fluid-handling component to the second electrically-insulating layer on the electronic component.

8 more elements

Dependencies are inferred from the claim text.

Microfluidic devices having embedded metal conductors and methods of fabricating said devices

Life of this patent

Microfluidic devices having embedded metal conductors and methods of fabricating said devices

Life of this patent

Abstract

Claims37