US 6,787,288 B2 · Negative resist composition, method for the formation of resist patterns and process for the production of electronic devices

Abstract

The negative resist composition comprises (1) a film-forming polymer which is itself soluble in basic aqueous solutions, and contains a first monomer unit with an alkali-soluble group in the molecule and a second monomer unit with an alcohol structure on the side chain which is capable of reacting with the alkali-soluble group, and (2) a photo acid generator which, when decomposed by absorption of image-forming radiation, is capable of generating an acid that can induce reaction between the alcohol structure of the second monomer unit and the alkali-soluble group of the first monomer unit, or protect the alkali-soluble group of the first monomer unit. The resist composition can form intricate negative resist patterns with practical sensitivity and no swelling.

Claims22

Dependent claims

A negative resist composition comprising a base resin comprising an alkali-soluble polymer, a photo acid generator which is capable of decomposing absorption of image-forming radiation to generate an acid, and an alicyclic alcohol with a reactive site that can undergo dehydration bonding reaction with an alkali-soluble group in the alkali-soluble polymer of said base resin in the presence of the acid generated by said photo acid generator, thereby making sections of said resist composition alkali-insoluble upon exposure of said resist composition to light, and

wherein the molecular weight distribution of said polymer in the sections rendered insoluble by light exposure is between 1 and 2 inclusive.

Dependencies are inferred from the claim text.

Facts

Application

10/291,730Filed 12 Nov 2002 · division

Priority

JP 11-2486192 Sep 1999

Published

US 2003/0138726 A124 Jul 2003

Granted

7 Sep 2004

Term ends

Not estimatedThe source records don’t support an estimate.

Classification13 codes

H10P 76/2041
Of organic photoresist masks: photolithographic processes
G03F 7/0045
Photosensitive materials: with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
G03F 7/038
Photosensitive materials: macromolecular compounds which are rendered insoluble or differentially wettable
H10D 64/01326
Characterised by the conductor: aspects related to lithography, isolation or planarisation of the conductor

Negative resist composition, method for the formation of resist patterns and process for the production of electronic devices

Life of this patent

Negative resist composition, method for the formation of resist patterns and process for the production of electronic devices

Life of this patent

Abstract

Claims22