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US 6,787,247 B2Granted
Injection molded heat dissipation device
AssigneeIntel Corporation
InventorJoseph A. Benefield
Life of this patent
Estimating the term…
Abstract
Heat dissipation devices and molding processes for fabricating such devices, which have at least two regions comprising different conductive materials such that efficient thermal contact is made between the different conductive materials. The molding processes include injection molding at least two differing conductive materials.
Claims12
A heat dissipation device, comprising:
- a first substantially hemispherical, highly thermally conductive portion;
- and
- a second thermally conductive portion abutting said first highly thermally conductive portion with a molded interface.
A microelectronic assembly, comprising:
- a microelectronic die;
- a heat dissipation device abutting said microelectronic die, wherein said heat dissipation device comprises:
- a first substantially hemispherical, highly thermally conductive portion;
- and
- a second thermally conductive portion abutting said first highly thermally conductive portion with a molded interface.
2 more elements
Dependencies are inferred from the claim text.