US 6,787,242 B2 · Methods of using adhesion enhancing layers and microelectronic integrated modules including adhesion enhancing layers

Abstract

Adhesion promoters for polymer coatings on metals are articulated into at least two head groups connected by a hydrocarbon spacer group. One head group reacts particularly well with polymer molecules. Other head groups form a durable bond with a metal surface. The length of the spacer group is such that a substance deposited in a substance layer on a metallic surface of a body or particle has hydrophobic properties. Suitable adhesion promoters can be sulfur compounds, amino compounds, hydroxyl or carbonyl compounds. A plastic composite body, a compound and a process of preparing a compound are also provided.

Claims20

Dependent claims

A microelectronic integrated module, comprising:

a base body made from metallic material;
a casing made from polymeric material;
and
an adhesion enhancing layer disposed between said base body and said casing, said adhesion enhancing layer being selected from the group consisting of:
a bifunctional thioalcohol with a hydrophobic chain portion;
a bifunctional disulfide with a hydrophobic chain portion;
an ethylene diamine;
and
a phthalocyanine with a hydrophobic chain portion amidated with at least one of a ω-hydroxylalkylamine and a bifunctional urea with a hydrophobic chain portion.

6 more elements

Dependencies are inferred from the claim text.

Facts

Application

10/454,522Filed 4 Jun 2003 · division

Priority

DE 197 57 30222 Dec 1997

Published

US 2003/0207114 A16 Nov 2003

Granted

7 Sep 2004

Term ends

Not estimatedThe source records don’t support an estimate.

Classification20 codes

C23F 11/141
Nitrogen-containing compounds: amines; Quaternary ammonium compounds
B82Y 30/00
Nanotechnology for materials or surface science
B82Y 40/00
Manufacture or treatment of nanostructures
C23F 11/142
Amines; Quaternary ammonium compounds: hydroxy amines

Family

PCT/EP98/08209Parent of this continuation · filed 15 Dec 1998

Application09/599,273Parent of this division · filed 22 Jun 2000

US 2003/0207114 A1Pre-grant publication · published 6 Nov 2003

Application09/599,273Parent of this continuation

US 6,787,242 B2This patent

From the US filing history. Foreign family members aren’t listed.

Methods of using adhesion enhancing layers and microelectronic integrated modules including adhesion enhancing layers

Life of this patent

Methods of using adhesion enhancing layers and microelectronic integrated modules including adhesion enhancing layers

Life of this patent

Abstract

Claims20