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US 6,787,224 B2Granted
Cover tape for packaging electronic components
AssigneeSumitomo Bakelite Co., Ltd.
InventorsHisao Nakanishi, Masayuki Hiramatsu
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AssigneeSumitomo Bakelite Co., Ltd.
InventorsHisao Nakanishi, Masayuki Hiramatsu
Estimating the term…
A cover tape for packaging electronic components, which can prevent troubles associated with the peeling strength or trouble appearing during mounting of the electronic components, which can be produced at a low cost, and which is transparent; that is, a cover tape has a peeling strength not too high and not too low and small in difference between the maximum value and the minimum value and which has high transparency. Specifically, the cover tape for packaging electronic components, which can be heat-sealed to a plastic-made carrier tape having pockets capable of storing electronic components, formed regularly therein and which is made of (A) a biaxially oriented film layer made of polyester, a polypropylene or a nylon and (B) a thermoplastic resin layer composed of 100 parts by weight of an ethylene copolymer and 10 to 100 parts by weight of polystyrene, laminated to one side of the layer A.
A cover tape for packaging electronic components, which can be heat-sealed to a plastic-made carrier tape having pockets capable of storing electronic components, formed regularly therein and which comprises a layer (A) of a biaxially oriented film layer made of a member selected from the group consisting of polyester, polypropylene and nylon and a layer (B) of a thermoplastic resin layer composed of 100 parts by weight of an ethylene copolymer and 10 to 100 parts by weight of a polystyrene, laminated to one side of the layer A, based on the total weight of the thermoplastic resin layer, wherein the proportion of a comonomer of the ethylene copolymer contained in the layer B is 17 to 90 parts by weight relative to 100 parts by weight of ethylene.
Dependencies are inferred from the claim text.