Semiconductor resin molding method
AssigneeKabushiki Kaisha Toshiba
InventorMika Kiritani
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Abstract
A resin tape substrate with a semiconductor chip mounted thereon is put to an attachment area surface of a cavity bottom surface, and a plurality of suction holes connected to a suction system are disposed in the attachment area surface, wherein the attachment area surface of the cavity is formed in a semiconductor resin mold, so that the molten resin given into the cavity does not flow into the back surface of the resin tape substrate which is sucked on the attachment area surface in the mold.
Claims9
A semiconductor resin molding method of sealing a mount portion of a semiconductor chip on a resin tape substrate with a resin molded body excluding a back surface of the resin tape substrate, said method comprising:
- preparing a mold comprising a cavity having a plurality of suction holes connectable to a suction system in an attachment surface to which said resin tape substrate is attached, the plurality of suction holes being grouped into a first group of suction holes and a second group of suction holes;
- attaching said resin tape substrate to the attachment surface of the cavity of said mold;
- sucking/fixing said resin tape substrate to the attachment surface of said cavity after attaching said resin tape substrate to the attachment surface by first sucking the resin tape substrate through the first group of suction holes and then sucking the resin tape substrate through the second group of suction holes after a lapse of a predetermined time interval;
- and
- supplying a resin into the cavity of said mold after the step of sucking/fixing said resin tape substrate onto the attachment surface.
Dependencies are inferred from the claim text.