Reaction injection and compression molding of a golf ball

A method of molding a layer of a thermoset or thermoplastic material around a golf ball component within a mold, comprising:

• placing the golf ball component within a mold cavity defined by opposing mold potions of the mold to leave a cavity space between the component and the mold portions substantially surrounding the component;
• providing a pre-mixed reaction mixture that comprises at least two reactants comprising an isocyanate and a polyol or polyamine;
• injecting the mixture under the hydraulic pressure into the cavity space to form a pressurized mixture;
• pushing the mold portions apart to a partially open position with an opening therebetween by overcoming a first tonnage with the pressurized mixture;
• allowing the reaction mixture to partially react within the cavity space;
• compressing the mold portions toward each other to a closed position;
• and
• allowing the reaction mixture to further react to form the layer of the thermoset or thermoplastic material to substantially encapsulate the component.

A method of molding a layer of a thermoset material around a golf ball component within a mold, comprising:

• placing the golf ball component on a support member within a mold cavity defined by opposing mold potions of the mold to leave a cavity space between the component and the mold portions substantially surrounding the component;
• providing a pre-mixed reaction mixture that comprises at least two reactants;
• injecting the mixture under the hydraulic pressure into the cavity space through an opening of at least about 0.001 inches between the mold portions in a partially open position;
• filling at least about 80% of the cavity space with the mixture in the partially open position;
• allowing the reaction mixture to partially react within the cavity space;
• compressing the mold portions toward each other under a tonnage to a closed position;
• and
• allowing the reaction mixture to further react to form the layer of the thermoset or material no greater than about 0.03 inches in thickness to substantially encapsulate the component.