Non-thermionic sputter material transport device, methods of use, and materials produced thereby

A sputter transport device comprising:

• (a) a sealable, pressure-controlled chamber;
• (b) a target cathode holder disposed in the chamber;
• (c) a magnetron assembly disposed in the chamber proximate to the target cathode;
• (d) a substrate holder disposed in the chamber and spaced at a distance from the target cathode holder;
• and
• (e) a negatively-biased, non-thermionic electron/plasma injector assembly disposed between the target cathode and the substrate holder, the injector assembly comprising:
• (i) a main body having a generally annular orientation with respect to a central axis and including a process gas section and a cooling section, the process gas section defining a process gas chamber and the cooling section defining a heat transfer fluid reservoir;
• and
• (ii) a plurality of gas nozzles removably disposed in the main body in a radial orientation with respect to the central axis and in heat transferring relation to the heat transfer fluid reservoir, each gas nozzle providing fluid communication between the process gas chamber and a region exterior to the main body.