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US 6,786,944 B2Granted
Aqueous dispersion for chemical mechanical polishing
AssigneeJsr Corporation
InventorsMasayuki Hattori, Michiaki Ando, Kazuo Nishimoto, Nobuo Kawahashi
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AssigneeJsr Corporation
InventorsMasayuki Hattori, Michiaki Ando, Kazuo Nishimoto, Nobuo Kawahashi
Estimating the term…
An aqueous dispersion for chemical mechanical polishing that is hard to putrefy, scarcely causes scratches, causes only small dishing and is suitable for used in a micro isolating step or a planarizing step of an inter layer dielectric in production of semiconductor devices, which dispersion comprises ceria particles, a preservative composed of a compound having a heterocyclic structure containing a nitrogen atom and a sulfur atom in the ring, such as an isothiazolone compound, and an organic component such as organic abrasive grains composed of resin particles, a dispersing agent composed of a water-soluble polymer having a specific molecular weight or the like, a surfactant and/or an organic acid or a salt thereof contained in an aqueous medium, wherein the ceria particles, preservative and organic component are contained in proportions of 0.1 to 20% by mass, 0.001 to 0.2% by mass and 0.1 to 30% by mass, respectively, when the total proportion of the aqueous medium, ceria particles, preservative and organic component is 100% by mass, and wherein the pH of this aqueous dispersion can be kept in a neutral range.
An aqueous dispersion for chemical mechanical polishing comprising ceria particles, a preservative comprising an isothiazolone compound, and an organic component comprising at least one of (i) organic abrasive grains comprising resin particles, and (ii) a water-soluble polymer having a molecular weight of at least 100, contained in an aqueous medium, wherein the ceria particles, preservative and organic components are contained in proportions of 0.1 to 20% by mass, 0.001 to 0.2% by mass and 0.1 to 30% by mass, respectively, when the total proportion of the aqueous medium, the ceria particles, the preservative and the organic component is 100% by mass.
A process comprising chemical mechanical polishing a surface of a wafer with an aqueous dispersion comprising ceria particles, a preservative comprising an isothiazolone compound, and an organic component comprising at least one of (i) organic abrasive grains comprising resin particles, and (ii) a water-soluble polymer having a molecular weight of at least 100, contained in an aqueous medium, wherein the ceria particles, preservative and organic component are contained in proportions of 0.1 to 20% by mass, 0.001 to 0.2% by mass and 0.1 to 30% by mass, respectively, when the total proportion of the aqueous medium, the ceria particles, the preservative and the organic component is 100% by mass.
Dependencies are inferred from the claim text.