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US 6,786,771 B2Granted
Interconnection system with improved high frequency performance
AssigneeTeradyne, Inc.
InventorMark W. Gailus
Life of this patent
Estimating the term…
Abstract
An interconnection system is described. Absorptive material is selectively positioned throughout the system to improve the high frequency performance of the system. Various embodiments are illustrated, including a backplane-daughtercard connector and a printed circuit board.
Claims11
A circuit board assembly having an interconnection system, wherein the interconnection system includes an electrical connector comprising:
- a) a plurality of rows of conductive signal members;
- b) a ground plate corresponding to each of the plurality of rows of conductive signal members;
- and
- c) absorptive material corresponding to and provided for each of the plurality of rows of conductive signal members, the absorptive material absorbing unwanted modes of electromagnetic energy in relation to the modes propagating desired signals through the interconnection system.
1 more element
An interconnection system having an electrical connector, the electrical connector comprising:
- a plurality of wafers;
- each of the plurality of wafers having an insulative housing, a plurality of elongated signal conductors and a ground member for shielding the signal conductors;
- and
- each of the plurality of wafers also provided with an electromagnetic absorptive member, the electromagnetic absorptive members being positioned to preferentially absorb unwanted radiation.
1 more element
Dependencies are inferred from the claim text.