Epoxy resin bonding pad for a ceramic orthodontic appliance
AssigneeTP Orthodontics, Inc.
InventorsAndrew C. Kesling, Thrumal Devanathan
Life of this patent
Estimating the term…
Abstract
A light-curable methacrylate based epoxy resin bonding pad molded to a ceramic orthodontic appliance, wherein the epoxy resin is made of bisphenol glycidyl methacrylate, tetra-hydrofurfuryl methacrylate, titanium dioxide, and camphor quinone, and the invisible light transmittance through the appliance and the pad is on the order of five percent plus or minus two percent.
Claims16
In combination with a ceramic orthodontic appliance, an acrylic based epoxy resin bonding base molded onto the lingual side of the appliance, said epoxy resin comprising 50 percent by weight bisphenol glycidyl methacrylate, 48 percent by weight tetra-hydrofurfuryl methacrylate, 0.5 percent by weight titanium dioxide, and 1.5 percent by weight catalyst, said percent by weight values ranging plus or minus ten percent.
A polycrystalline ceramic orthodontic appliance having an acrylic modified light-cured epoxy resin bonding base molded to the appliance for mounting the appliance to a tooth, said epoxy bonding base comprising by weight:
- about 50 percent bisphenol glycidyl methacrylate, about 48 percent tetra-hydrofurfuryl methacrylate, about 0.5 percent light-blocking oxide pigment, and about 1.5 percent catalyst.
An acrylic light-curable epoxy resin bonding pad for molding onto a ceramic orthodontic bracket comprising by weight:
- about 50 percent bisphenol glycidyl methacrylate, about 48 percent tetra-hydrofurfuryl methacrylate, about 0.5 percent light-blocking oxide pigment, and about 1.5 percent catalyst, said percent by weight values ranging plus or minus ten percent.
The method of mounting an acrylic epoxy resin bonding pad to a ceramic othodonic appliance, said method comprising preparing the epoxy resin by combining by weight about 50 percent bisphenol glycidal methacrylate, about 48 percent tetra-hydrafurfuryl methacrylate, about 0.5 percent titanium dioxide, and about 1.5 percent camphor quinone, said percent by weight values ranging plus or minus ten percent, depositing the epoxy resin in a mold, setting an appliance in the resin, and subjecting the resin to a curing light to cure the resin.
Dependencies are inferred from the claim text.