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US 6,786,391 B2Granted
Method of controlling solder deposition utilizing two fluxes and preform
AssigneeKAC Holdings, Inc.
InventorsJohn N. Stipp, Brian T. Deram
Life of this patent
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AssigneeKAC Holdings, Inc.
InventorsJohn N. Stipp, Brian T. Deram
Estimating the term…
Method for controlling the deposition of solder on a base metal or substrate is disclosed. The method comprises applying an attaching flux and finishing flux to a substrate, placing a preform thereon and subjecting the same to reflow conditions. The finishing flux is applied to solubilize the normally insoluble corrosive residues that would occur when the attaching flux is subjected to reflow conditions with the preform and substrate. Alternatively, the attaching flux may be applied to the preform and substrate before undergoing reverse reflow conditions and then the finishing flux is applied to the solder deposit and substrate and the same subjected to second reflow conditions. After each method, the residues left from the attaching flux which are solubilized by the finishing flux, are cleaned by washing with a typical solvent.
A method of controlling solder deposition on base metal utilizing two fluxes and preformed solder comprising:
The method of controlling solder deposition on a base metal utilizing dual fluxes and preformed solder comprising:
Dependencies are inferred from the claim text.