Method for clamping and wire-bonding the leads of a lead frame one set at a time
AssigneeMicron Technology, Inc.
InventorsMichael B. Ball, Rich Fogal
Life of this patent
Estimating the term…
Abstract
A wire-bonding machine includes a heat block for supporting a lead frame during wire-bonding. A clamp mechanism in the machine clamps leads of the lead frame during wire-bonding by fixedly holding sets of the leads against the heat block one set at a time. A wire-bonding tool wire-bonds leads clamped by the clamp mechanism to bond pads on an integrated circuit die. By clamping leads of the lead frame in separate sets, the machine provides improved clamping for lead frames with leads requiring clamping in different planes.
Claims17
A wire bonding method for a wire bonding apparatus, the wire bonding method for holding at least portions of a plurality of leads of a lead frame comprising clamping a plurality of at least three sets of the plurality of leads of the lead frame, one set of leads at a time, with each set of the plurality of sets of the plurality of leads of the lead frame including fewer than all the leads of the plurality of leads of the lead frame, at least one set of leads of the plurality of sets of the plurality of leads of the lead frame including more than one of the leads, and at least one set of leads of the plurality of sets of the plurality of leads being clamped on a different plane than at least one other set of leads of the plurality of leads.
A wire bonding method for a wire bonding apparatus, the wire bonding method for wire-bonding a plurality of leads of each lead frame of a plurality of lead frames in a lead frame strip to bond pads on integrated circuit dice connected to the plurality of lead frames, the method comprising:
- moving each lead frame of the plurality of lead frames in the lead frame strip to a position;
- clamping a plurality of at least three sets of the plurality of leads of each lead frame at the position, one set at a time, having each set of the leads of the plurality of at least three sets including fewer than all of the leads of each lead frame, at least one set including more than one lead of the plurality of leads of each lead frame and at least one set of the plurality of leads being clamped on a different plane than at least one other set of the plurality of leads;
- and
- forming wire-bonds between portions of the at least one set of the plurality of leads to portions of the bond pads on the integrated circuit dice connected to the lead frames.
A method for clamping a plurality of leads of a lead frame, each lead having a wire bonding region thereof, the method comprising:
- determining a distance between the wire bonding region of at least two leads of the plurality of leads and a center portion of the lead frame;
- subdividing the plurality of leads into at least two sets of leads based on a distance between their respective wire bonding regions and the center portion of the lead frame;
- and
- clamping each set of leads, one set of leads at a time.
A method of clamping at least two leads of a plurality of leads of a lead frame, at least one lead lying in a different plane than at least one other lead, the method comprising:
- determining a plane of at least two sets of leads of the plurality of leads in which at least one lead of the at least two sets of leads lies;
- subdividing the plurality of leads into the at least two sets of leads with respect to the plane in which the at least one lead of the at least two sets of leads lies;
- and
- clamping each set of leads, one set of leads at a time.
A method for connecting a plurality of leads of lead frames in a lead frame strip to at least one bond pad of a plurality of bond pads on integrated circuit dice attached to the lead frames, the method comprising:
- positioning each lead frame in the lead frame strip at a position;
- clamping a plurality of at least two sets of leads of the plurality of leads of each of the lead frames indexed to the position, one set at a time, with each set of leads including fewer than all of the leads of each lead frame and at least one set of leads including more than one of the leads of each lead frame;
- forming wire-bonds between at least one lead of each of the sets of clamped leads to the at least one bond pad of the plurality of bond pads on the integrated circuit dice attached to the lead frame of the clamped leads;
- and
- testing at least one wire-bond between the at least one lead of each of the lead frames at the position and the bond pads of the integrated circuit dice while other leads of the lead frame are clamped.
Dependencies are inferred from the claim text.