Semiconductor device with gold bumps, and method and apparatus of producing the same
AssigneeFujitsu Limited
InventorsMasayuki Kitajima, Masakazu Takesue, Yoshitaka Muraoka
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Abstract
A semiconductor device includes a semiconductor element having electrodes and metal bumps are attached to the electrodes. The metal bumps include copper cores and gold surface layers covering the cores. In addition, the metal bumps may include gold bump elements and solder bump elements connected together.
Claims5
An apparatus for producing semiconductor devices comprising:
- a booth;
- a flux vessel disposed in said booth;
- a molten-solder vessel arranged in said booth so that gold bump elements provided on the electrodes of a semiconductor element can be immersed in said vessel;
- a vertically movable support member for supporting said semiconductor element;
- means for supplying inert gas into said booth;
- and means for detecting the oxygen concentration in said booth.
An apparatus for producing semiconductor devices comprising a molten-solder vessel arranged so that gold bump elements provided on the electrodes of a semiconductor element can be immersed in said vessel, and a support structure for hanging said semiconductor element, said support structure including a hanging mechanism comprising at least two mutually movably coupled coupling members so that the semiconductor element can float on the molten solder.
An apparatus for producing semiconductor devices comprising a molten-solder vessel arranged so that gold bump elements provided on the electrodes of a semiconductor element can be immersed in said vessel, and a support structure for holding said semiconductor element, said support structure including a holding mechanism comprising at least two mutually movably coupled coupling members so that the semiconductor element can float on the molten solder and a pump-type adsorption head having an open suction hole for holding the semiconductor element.
Dependencies are inferred from the claim text.