Showerhead electrode design for semiconductor processing reactor
AssigneeLam Research Corporation
InventorsRajinder Dhindsa, Eric Lenz
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Abstract
An electrode assembly of a semiconductor processing chamber wherein heat transfer between a backing plate and a showerhead electrode is improved by an electrostatic clamping arrangement, which includes a compliant material in contact with a surface of the showerhead electrode. The showerhead electrode is removably attached to the backing plate by a mechanical clamping arrangement which engages an outer periphery of the showerhead electrode. The electrostatic clamping arrangement is coextensive with the showerhead electrode to improve thermal conduction between the backing plate and the showerhead electrode.
Claims22
An apparatus for retaining an electrode plate in a plasma reaction chamber, comprising:
- a backing plate having an electrode plate receiving surface;
- an electrostatic holding apparatus disposed upon said electrode plate receiving surface, the electrostatic holding apparatus having an electrode plate support surface;
- and
- an electrode plate having a lower surface facing a substrate to be processed and an upper contact surface, the electrostatic holding apparatus being operable to compress the upper contact surface against the electrode plate receiving surface.
A method of assembling an apparatus for retaining an electrode plate in a plasma reaction chamber, comprising;
- attaching an electrostatic holding apparatus to an electrode plate receiving surface, the electrostatic holding apparatus having an electrode plate support surface of a backing plate;
- and
- operating the electrostatic holding apparatus to compress an upper contact surface of an electrode plate against the electrode plate receiving surface, a lower surface of the electrode plate facing a substrate to be processed.
Dependencies are inferred from the claim text.