US 6,785,458 B2 · Guided-wave optical interconnections embedded within a microelectronic wafer-level batch package

Abstract

Wafer-level electronic packages having waveguides and methods of fabricating chip-level electronic packages having waveguides are disclosed. A representative chip-level electronic package includes at least one waveguide having a waveguide core. In addition, another representative chip-level electronic package includes a waveguide having an air-gap cladding layer around a portion of the waveguide core. A representative method for fabricating a chip-level electronic package includes: providing a substrate having a passivation layer disposed on the substrate; disposing a waveguide core on a portion of the passivation layer; disposing a first sacrificial layer onto at least one portion of the passivation layer and the waveguide core; disposing an overcoat layer onto the passivation layer and the first sacrificial layer; and removing the first sacrificial layer to define an air-gap cladding layer within the overcoat polymer layer and around a portion of the waveguide core.

Claims13

Dependent claims

A chip-level electronic package comprising:

at least one monolithic waveguide having;
a waveguide core disposed in a fixed position on a lower cladding,
an air-gap cladding around a portion of the waveguide core, and
an overcoat layer engaging a portion of the air-gap cladding and engaging the lower cladding, wherein the air-gap cladding is completely bound on all sides by the overcoat layer, the lower cladding and the waveguide core.

1 more element

Dependencies are inferred from the claim text.

Facts

Application

10/074,420Filed 11 Feb 2002 · us provisional application

Priority

11 Feb 2001

Published

US 2002/0136481 A126 Sep 2002

Granted

31 Aug 2004

Term ends

Not estimatedThe source records don’t support an estimate.

Classification9 codes

G02B 6/43
Coupling light guides with opto-electronic elements: arrangements comprising a plurality of opto-electronic elements and associated optical…
G02B 6/10
Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings: of the optical waveguide type
G02B 6/12002
Of the integrated circuit kind: three-dimensional structures
G02B 6/1221
Basic optical elements, e.g. light-guiding paths: made from organic materials

Guided-wave optical interconnections embedded within a microelectronic wafer-level batch package

Life of this patent

Guided-wave optical interconnections embedded within a microelectronic wafer-level batch package

Life of this patent

Abstract

Claims13