Semiconductor memory device having a memory cell structure of reduced occupying area
AssigneeRenesas Technology Corp.
InventorsKazutami Arimoto, Hiroki Shimano
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AssigneeRenesas Technology Corp.
InventorsKazutami Arimoto, Hiroki Shimano
Estimating the term…
Conductive lines constituting word lines of memory cells and conductive lines constituting memory cell plate electrodes are formed in the same interconnecting layer in a memory device including a plurality of memory cells each including a capacitor for storing data in an electrical charge form. By forming the capacitors of the memory cells into a planar capacitor configuration, a step due to the capacitors is removed. Thus, a dynamic semiconductor memory device can be formed through CMOS process, and a dynamic semiconductor memory device suitable for merging with logic is achieved. Data of 1 bit is stored by two memory cells, and data can be reliably stored even if the capacitance value of the memory cell is reduced due to the planar type capacitor.
A semiconductor memory device, comprising:
A semiconductor memory device, comprising:
The semiconductor memory device according to 12, wherein each cell plate electrode is arranged corresponding to each respective memory cell row.
A semiconductor memory device, comprising:
Dependencies are inferred from the claim text.