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US 6,785,144 B1Granted
High density stackable and flexible substrate-based devices and systems and methods of fabricating
AssigneeMicron Technology, Inc.
InventorSalman Akram
Life of this patent
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AssigneeMicron Technology, Inc.
InventorSalman Akram
Estimating the term…
A flexible carrier substrate assembly or module that facilitates stacking of multiple carrier substrates bearing semiconductor dice for high density electronic systems. After the dice are placed on the flexible substrate, a flexible support frame may be applied to the flexible substrate. The support frame includes conductive paths therethrough to connect to circuit traces running from the dice on the substrate to the substrate perimeter to interconnect superimposed carrier substrates. The flexible carrier substrates may be bent to a radius of any given curvature to conform to various non-planar regular and irregular surfaces. Furthermore, since the frame as well as the substrate may be flexible, multiple, flexible substrate assemblies may be stacked one on top of another wherein an upper assembly has a different radius than a lower module and any intermediate assemblies have progressively differing radii from bottom to top position.
A computer system comprising:
A computer system comprising:
A computer system comprising:
Dependencies are inferred from the claim text.