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US 6,785,140 B2Granted
Multiple heat pipe heat sink
AssigneeDell Products L.P.
InventorsPaul T. Artman, Eric Tunks
Life of this patent
Estimating the term…
Abstract
A chassis includes a heat generating component. A base is mounted on the heat generating component. A plurality of heat pipes each have a first portion mounted in the base and a second portion extending from the base. A plurality of fins are mounted on the second portion of the heat pipes. The heat pipes are L-shaped and the first portion of each heat pipe is seated in a respective groove provided in the base.
Claims22
A cooling apparatus comprising:
- a base having a peripheral surface, a heat contact surface and an opposed planar surface having surface openings formed therein, the openings extending into the base such that they are spaced from the heat contact surface;
- a plurality of heat pipes including a first portion seated in the openings exposed adjacent to and extending substantially parallel to the opposed planar surface;
- and
- a plurality of fins mounted on a second portion of the heat pipes, each fin having a peripheral edge which does not extend beyond the peripheral surface of the base.
1 more element
A chassis comprising:
- a heat generating component mounted in the chassis;
- a base having a peripheral surface, a heat contact surface mounted on the heat generating component and an opposed planar surface having surface openings formed therein, the openings extending into the base such that they are spaced from the heat contact surface;
- a plurality of heat pipes having a first portion seated in the openings exposed adjacent to and extending substantially parallel to the opposed planar surface;
- and
- a plurality of fins mounted on a second portion of the heat pipes, each fin having a peripheral edge which does not extend beyond the peripheral surface of the base.
2 more elements
An information handling system comprising:
- a chassis;
- a microprocessor mounted in the chassis;
- a storage coupled to the microprocessor;
- a base having a peripheral surface, a heat contact surface mounted on the microprocessor and an opposed planar surface having surface openings formed therein, the openings extending into the base such that they are spaced from the heat contact surface;
- a plurality of heat pipes having a first portion seated in the openings exposed adjacent to and extending substantially parallel to the opposed planar surface;
- and
- a plurality of fins mounted on a second portion of the heat pipes, each fin having a peripheral edge which is substantially coextensive with the peripheral surface of the base.
4 more elements
A method of cooling a component comprising:
- providing a chassis;
- mounting a heat generating component in the chassis;
- mounting a base on the heat generating component;
- providing the base with a peripheral surface, a heat contact surface mounted on the heat generating component and an opposed planar surface having surface openings formed therein, the openings extending into the base such that they are spaced from the heat contact surface;
- mounting a first portion of a plurality of heat pipes in the openings exposed adjacent to and extending substantially parallel to the opposed planar surface;
- and
- mounting a plurality of fins on a second portion of the heat pipes.
4 more elements
Dependencies are inferred from the claim text.