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US 6,785,137 B2Granted
Method and system for removing heat from an active area of an integrated circuit device
AssigneeSTMicroelectronics S.r.l.
InventorHarry Michael Siegel
Life of this patent
Estimating the term…
Abstract
A method for removing heat from an active area of an integrated circuit device is provided. The method includes applying a separator to the active area of the integrated circuit device. A thermally conductive element is coupled to the active area of the integrated circuit device outwardly of the separator.
Claims20
A method for removing heat from an active area of an integrated circuit device, comprising:
- applying a separator to the active area of the integrated circuit device;
- coupling a thermally conductive element to the active area of the integrated circuit device outwardly of the separator;
- and
- coupling a spacer between the active area of the integrated circuit device and the thermally conductive element.
1 more element
A method for removing heat from an active area of an integrated circuit device, comprising:
- forming an integrated circuit device;
- exposing an active area of the integrated circuit device;
- applying a separator to the active area of the integrated circuit device;
- coupling a thermally conductive element to the active area of the integrated circuit device outwardly of the separator;
- and
- coupling a spacer between the active area of the integrated circuit device and the thermally conductive element.
3 more elements
A system for removing heat from an active area of an integrated circuit device, comprising:
- a separator coupled to the active area of the integrated circuit device;
- a thermally conductive element coupled to the active area of the integrated circuit device outwardly of the separator;
- and
- a spacer coupled between the active area of the integrated circuit device and the thermally conductive element.
1 more element
Dependencies are inferred from the claim text.