US 6,785,134 B2 · Embedded liquid pump and microchannel cooling system

Abstract

Apparatus and methods in accordance with the present invention provide self-contained, closed-loop microchannel/electrokinetic pump cooling systems that can be integrated into the microelectronic die and the integrated heat sink to provide microelectronic die cooling. Microchannel/electrokinetic pump cooling systems utilize active cooling technology to reduce thermal gradients and operating temperature of a microelectronic die. This system disclosed here will enhance heat dissipation and provide immediate cooling of localized hot spots within the microelectronic die. This will have the effect of reducing the microelectronic die temperature or spreading the heat internally within the microelectronic die depending on the layout of the microchannels.

Claims16

Dependent claims

An apparatus comprising:

a substrate comprising an integrated heat spreader including microchannels in fluid communication with an electrokinetic pump housed within the integrated heat spreader,
the electrokinetic pump including
a fluid;
a reservoir, formed integral with the integrated heat spreader, in fluid communication with the microchannels;
and
a plurality of electrodes adapted to provide a pressure differential by electrolysis of the fluid;
and
a microelectronic die including internal die microchannels, the die microchannels in fluid communication with the microchannels within the integrated heat spreader.

5 more elements

Dependencies are inferred from the claim text.

Embedded liquid pump and microchannel cooling system

Life of this patent

Embedded liquid pump and microchannel cooling system

Life of this patent

Abstract

Claims16