Method of fabricating LCD
AssigneeLG.Philips LCD Co., Ltd.
InventorsSang Seok Lee, Sang Ho Park
Life of this patent
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Abstract
Method for fabricating an LCD having the liquid crystal dropping method applied thereto, including providing a first substrate and a second substrate having seals formed thereon, loading the first and second substrates into a bonding chamber, bonding the first and second substrates, setting the bonded first and second substrates, venting the bonding chamber for applying a pressure to the first and second substrates, and unloading the first and second substrates having the pressure applied thereto.
Claims41
A method for fabricating a liquid crystal display (LCD) comprising:
- providing a first substrate and a second substrate having seals formed thereon;
- loading the first and second substrates into a bonding chamber;
- bonding the first and second substrates;
- setting the bonded first and second substrates;
- venting the bonding chamber for applying a pressure to the bonded first and second substrates;
- and
- unloading the first and second substrates having the pressure applied thereto.
A method for fabricating a liquid crystal display (LCD), comprising:
- loading first and second substrates having liquid crystal dropped thereon and seals formed thereon into a bonding chamber;
- bonding the first and second substrates;
- venting the bonding chamber for applying a pressure to the bonded first and second substrates;
- and
- unloading the first and second substrates.
A method for fabricating a liquid crystal display (LCD), comprising:
- loading a first substrate, and second substrate having sealant coated thereon into a bonding chamber;
- bonding the first and second substrates;
- venting the bonding chamber for applying a pressure to the bonded first and second substrates;
- and
- unloading the set first and second substrates.
A method for fabricating a liquid crystal display (LCD), comprising:
- holding a first substrate at a lower stage within a bonding chamber;
- holding a second substrate at an upper stage within the bonding chamber, wherein sealant material is disposed between the held first and second substrates;
- evacuating the bonding chamber to a predetermined vacuum pressure;
- bonding the first and second substrates together within the evacuated bonding chamber via the sealant material;
- venting the evacuated bonding chamber after the bonding by injecting gas;
- and
- unloading the bonded first and second substrates from the vented bonding chamber.
Dependencies are inferred from the claim text.