Testing apparatus including testing board having wirings connected to common point and method of testing semiconductor device by composing signals
AssigneeRenesas Technology Corp.
InventorMasaaki Tanimura
Life of this patent
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AssigneeRenesas Technology Corp.
InventorMasaaki Tanimura
Estimating the term…
In a testing board (300C), one end of each of a plurality of first wirings (310) and one end of each of a plurality of second wirings (320) are connected to a common point (340). The other end of each of the second wirings (320) is connected to a terminal (12a-12f) of a semiconductor device (10) under test. The second wirings (320) have almost the same length. Signals outputted from drivers of a tester pin (130) to the first wirings (310) are composed at the common point (340), and the composite wave is inputted to the terminal (12a-12f) through each of the second wirings (320). A relay (350) is provided at a midpoint of each of the second wirings (320) and is controlled such that the signals can be inputted to, for example, the terminal (12b) from the driver of the tester pin (130) through one of third wirings (330).
A testing apparatus comprising:
A method of testing a semiconductor device comprising:
Dependencies are inferred from the claim text.