Electronic component and method for forming substrate electrode of the same
AssigneeMurata Manufacturing Co., Ltd.
InventorHiroaki Kaida
Life of this patent
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Abstract
An electronic component includes a case substrate. Substrate electrodes having a substantially spherical outer surface are disposed on at least a first principal surface of the case substrate. A piezoelectric resonator is mounted on the case substrate such that the piezoelectric resonator is bonded to the outer surfaces of the substrate electrodes by a conductive bonding material and is supported by the substrate electrodes in a point-contact manner. Also, the formula, Lk−2We<Lp<Lk−We, is satisfied where Lp is the length of the piezoelectric resonator, Lk is the length of the case substrate, and We is the length of the substrate electrode.
Claims7
An electronic component comprising:
- a case substrate having first and second principal surfaces facing each other;
- a plurality of substrate electrodes disposed on at least the first principal surface, each substrate electrode having a substantially spherical outer surface;
- an electronic component element, which is mounted on the first principal surface with a space therebetween and which is supported by the plurality of substrate electrodes in a point-contact manner;
- and
- a conductive bonding material bonding the electronic component element to the plurality of substrate electrodes.
Dependencies are inferred from the claim text.