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US 6,784,556 B2Granted
Design of interconnection pads with separated probing and wire bonding regions
AssigneeKulicke & Soffa Investments, Inc.
InventorPaul T. Lin
Life of this patent
Estimating the term…
Abstract
The present invention provides a solution to the problem of weakening bond integrity in integrated circuit devices due in part to test probes galling and weakening the interconnect pads during functional and reliability test probing. In doing so, the invention enables a lowering of the chance a bond wire or interconnect pad will be lifted during a wire bonding process or in normal operation of an integrated circuit device.
Claims9
An integrated circuit having an interconnect region, the interconnect region comprising:
- an interconnect pad having a first portion and a second portion, wherein the first portion of the interconnect pad overlies an inactive region of the integrated circuit;
- a visible indicator indicating a division between the first portion and the second portion, wherein the visible indicator has a contact surface in continuous contact with the interconnect pad;
- and
- a dielectric passivation layer having an opening that exposes both the first and second portions of the interconnect pad.
1 more element
Dependencies are inferred from the claim text.