Die attach adhesives for semiconductor applications utilizing a polymeric base material with inorganic insulator particles of various sizes
AssigneeDow Corning Corporation
InventorMichael John Watson
Life of this patent
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Abstract
Die attach adhesives and methods for their use, along with the devices that are obtained by the use of the methods. Using semiconductor chips as an example, the adhesives and the method for using them provides an interface between a chip (die) and the chip support. The method includes creating a space between the chip and the chip support of a given sized opening by using inorganic insulator particles having an average particle size of 1 μm to 1000 μm and a major axis to minor axis ratio of about 1.0 to 1.5.
Claims14
A curable adhesive composition comprising in combination:
- a curable polymeric base material and contained in said polymeric base material,
- (I) inorganic insulator particles having average particle size of 1 μm to 1000 μm and a major axis to minor axis ratio of about 1.0 to 1.5, said inorganic insulator particles being present in the composition in an amount sufficient to provide a planar adhesive bond thickness between substrates being joined by said adhesive, and
- (II) at least one low coefficient of thermal expansion filler having an average particle size of less than 10 μm in an amount of at least greater than 50 weight percent based on the weight of the curable polymeric base material, wherein the low coefficient of thermal expansion fillers having sizes of greater than 10 to about 100 μm are present in less than 0.1 weight percent based on the total weight of the low coefficient of thermal expansion fillers present in the adhesive composition.
A semiconductor device in which at least two individual substrates are joined and bonded by a curable adhesive composition, said curable adhesive composition comprising in combination a curable polymeric base material and contained in said polymeric base material,
- (I) inorganic insulator particles having an average particle size of 1 μm to 1000 μm and a major axis to minor axis ratio of about 1.0 to 1.5, said inorganic insulator particles being present in the composition in an amount sufficient to provide a planar adhesive bond thickness between substrates being joined by said adhesive, and
- (II) at least one low coefficient of thermal expansion filler having an average particle size of less than 10 μm in an amount of at least greater than 50 weight percent based on the weight of the curable polymeric base material, wherein the low coefficient of thermal expansion fillers having sizes of greater than 10 μm to about 100 μm are present in less than 0.1 weight percent based on the total weight of the low coefficient of thermal expansion fillers present in the adhesive composition.
Dependencies are inferred from the claim text.