Semiconductor device having pad electrode connected to wire
AssigneeNEC Compound Semiconductor Devices, Ltd.
InventorsToshimichi Kurihara, Takahiro Kawabata, Tetsu Toda, Shigeki Tsubaki
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Abstract
In a semiconductor device having a semiconductor substrate, an internal electrode layer is formed on the semiconductor substrate. A barrier metal layer is formed on the internal electrode. An external electrode layer is formed on the barrier metal layer. A pad electrode is made of the internal electrode layer, the barrier metal layer, and the external electrode layer. A wire is electrically connected to the pad electrode. An area of the external electrode layer is set midway between an area of a polymerization portion of the wire on the pad electrode and a planar area of the barrier metal layer.
Claims8
A semiconductor device having a semiconductor substrate, comprising:
- an internal electrode layer formed on the semiconductor substrate,
- a barrier metal layer formed on the internal electrode,
- an external electrode layer formed on the barrier metal layer, a pad electrode being made of the internal electrode layer, the barrier metal layer, and the external electrode layer, and
- a wire which is electrically connected to the pad electrode,
- wherein an area of the external electrode layer is set midway between an area of a polymerization portion of the wire on the pad electrode and a planar area of the barrier metal layer.
Dependencies are inferred from the claim text.