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US 6,784,544 B1Granted
Semiconductor component having conductors with wire bondable metalization layers
AssigneeMicron Technology, Inc.
InventorWarren M. Farnworth
Life of this patent
Estimating the term…
Abstract
A semiconductor component includes a semiconductor die, a low k polymer layer on the die and redistribution conductors on the polymer layer. The component also includes bonding pads on the conductors with a metal stack construction that includes a conductive layer, a barrier/adhesion layer and a non-oxidizing layer. The bonding pads facilitate wire bonding to the component and the formation of reliable wire bonds on the component. A method for fabricating the component includes the steps of forming the conductors and bonding pads using electroless deposition. The component can be used to fabricate electronic assemblies such as modules, packages and printed circuit boards.
Claims41
A semiconductor component comprising:
- a semiconductor die comprising an integrated circuit and a die contact in electrical communication with the integrated circuit;
- a polymer layer on the die;
- a redistribution conductor on the polymer layer comprising a conductive layer in electrical communication with the die contact;
- a wire bonding pad on the polymer layer comprising the conductive layer and a metal layer covering the conductive layer;
- and
- a non-oxidizing metal layer covering the metal layer and edges thereof configured to seal and protect the conductor and the wire bonding pad and to provide a wire bondable surface.
3 more elements
A semiconductor component comprising:
- a semiconductor die including a circuit side, a plurality of integrated circuits on the circuit side, and a plurality of die contacts on the circuit side in electrical communication with the integrated circuits;
- a polymer layer on the circuit side;
- a plurality of redistribution conductors on the polymer layer in electrical communication with the die contacts;
- and
- a plurality of wire bonding pads on the polymer layer in electrical communication with the conductors, the wire bonding pads and the conductors comprising a conductive layer, a barrier/adhesion layer covering the conductive layer and a non-oxidizing layer covering the barrier/adhesion layer and edges thereof configured to seal and protect the conductors and the wire bonding pads and provide wire bondable surfaces.
2 more elements
A semiconductor component comprising:
- a semiconductor die including a plurality of integrated circuits and a plurality of die contacts in electrical communication with the integrated circuits having a first pattern;
- a polymer layer on the die;
- a plurality of conductors on the polymer layer;
- and
- a plurality of wire bonding pads on the polymer layer in electrical communication with the conductors and having a second pattern;
- the conductors and the wire bonding pads comprising a metal stack including a conductive layer, a barrier/adhesion layer covering the conductive layer and a non-oxidizing layer covering the barrier/adhesion layer and edges thereof configured to seal and protect the conductors and the wire bonding pads and to provide wire bondable surfaces.
3 more elements
A semiconductor component comprising:
- a semiconductor die including a circuit side, a plurality of integrated circuits on the circuit side, and a plurality of die contacts on the circuit side in electrical communication with the integrated circuits having a first pattern;
- a polymer layer on the circuit side;
- a plurality of metal bumps on the die contacts in the polymer layer having a same planar surface as the polymer layer;
- a plurality of conductors on the planar surface in electrical contact with the bumps;
- and
- a plurality of wire bonding pads on the conductors having a second pattern;
- each conductor and each wire bonding pad comprising a conductive layer, a barrier/adhesion layer and a non-oxidizing layer configured to seal and protect the conductors and the wire bonding pads and to provide wire bondable surfaces.
4 more elements
An electronic assembly comprising:
- a supporting substrate comprising an electrode;
- a semiconductor component on the substrate comprising a semiconductor die having an integrated circuit, a die contact in electrical communication with the integrated circuit, a polymer layer on the die, a redistribution conductor on the polymer layer in electrical communication with the die contact, and a wire bonding pad on the polymer layer, the conductor and the wire bonding pad comprising a conductive layer, a barrier/adhesion layer covering the conductive layer and a non-oxidizing layer covering the barrier/adhesion layer and edges thereof configured to seal and protect the conductor and the wire bonding pad and to provide a wire bondable surface;
- and
- a wire bonded to the electrode and to the wire bonding pad.
1 more element
An electronic assembly comprising:
- a supporting substrate;
- an interposer on the supporting substrate comprising a polymer layer, a plurality of conductors on the polymer layer, and a plurality of wire bonding pads on the conductors, the conductors and the wire bonding pads comprising a conductive layer, a barrier/adhesion layer covering the conductive layer and a non-oxidizing layer covering the barrier adhesion layer and edges thereof configured to seal and protect the conductors and the wire bonding pads and to provide a wire bondable surface;
- and
- a semiconductor die on the interposer comprising a plurality of die contacts wire bonded to the wire bonding pads.
1 more element
An electronic assembly comprising
- a semiconductor die comprising a plurality of integrated circuits, a plurality of die contacts in electrical communication with the die contacts having a first pattern, a polymer layer, a plurality of metal bumps on the die contacts having a same planar surface as the polymer layer, a plurality of conductors on the polymer layer in electrical contact with the metal bumps, and a plurality of wire bonding pads on the conductors having a second pattern, each conductor and each wire bonding pad comprising a conductive layer, a barrier/adhesion layer covering the conductive layer and a non-oxidizing layer covering the barrier/adhesion layer and edges thereof configured to seal and protect the wire bonding pad and associated conductor and to provide a wire bondable surface;
- and
- a plurality of lead fingers attached to the die and wire bonded to the wire bonding pads.
Dependencies are inferred from the claim text.