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AssigneeHitachi, Ltd.
InventorsShuji Eguchi, Akira Nagai, Haruo Akahoshi, Takumi Ueno, Toshiya Satoh, Masahiko Ogino, Asao Nishimura, Ichiro Anjo, Hideki Tanaka
Estimating the term…
In a multi-chip module, a plurality of semiconductor chips are mounted on a single wiring board. Upper surfaces of the chips are covered with a single heat spread plate, and the whole space around the chips sandwiched between the wiring board and the heat spread plate is filled with resin. The semiconductor chips are interconnected through the resin so that any stress exerted on any chips is dispersed. This diminishes the occurrence of cracks caused by stress concentration. Since the chips and the heat spread plate are bonded together with resin, even if there are variations in size of the chips, both can be bonded easily. Further, the bonding of all the chips and the heat spread plate can be done in a single process.
A semiconductor module having a structure wherein a plurality of bare semiconductor chips or packaged semiconductor chips are mounted on a single wiring board and a single heat spread plate is disposed on said semiconductor chips, characterized in that said heat spread plate and said semiconductor chips are bonded to each other with resin, said resin is filled around said semiconductor chips so that they are sandwiched between said wiring board and said heat spread plate and said semiconductor chips are interconnected through said resin.
A method for mounting a semiconductor module comprising mounting a plurality of bare semiconductor chips or packaged semiconductor chips on a single wiring board, disposing a heat spread plate above said semiconductor chips, and filling a resin composition in a space formed between said wiring board and said heat spread plate, wherein after said semiconductor chips are mounted on said wiring board, said heat spread plate is put on the semiconductor chips, and said resin composition is poured so as to fill the whole of the space defined between said wiring board and said heat spread plate such that said wiring board, said semiconductor chips and said heat spread plate become fixedly secured.
Dependencies are inferred from the claim text.