Semiconductor device of surface-mounting type
AssigneeKabushiki Kaisha Toshiba
InventorKoji Moriguchi
Life of this patent
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Abstract
A semiconductor device of a surface-mounting type has a mount surface and includes a semiconductor chip having a first surface, a second surface, a heat-generating portion located nearer to the second surface than the first surface and that generates heat during operation, and at least one patterned electrode formed on the second surface. A resin covers the semiconductor chip and an electrode terminal is extracted from the first surface of the semiconductor chip. A mounting face of the electrode terminal and a surface of the at least one patterned electrode are exposed to be substantially flush with a plane of the mount surface, and a perimeter of the at least one patterned electrode is surrounded by the resin.
Claims18
A semiconductor device of a surface-mounting type having a mount surface, comprising:
- a semiconductor chip having a first surface, a second surface, a heat-generating portion located nearer to said second surface than said first surface and generating heat during operation, and at least one patterned electrode formed on said second surface;
- a resin provided to cover said semiconductor chip;
- and
- an electrode terminal extracted from said first surface of said semiconductor chip,
- a mounting face of said electrode terminal and a surface of said at least one patterned electrode being exposed to be substantially flush with a plane of said mount surface, and a perimeter of said surface of said at least one patterned electrode being surrounded by said resin.
A semiconductor device of a surface-mounting type having a mount surface, comprising:
- a lead frame;
- a semiconductor chip bonded to said lead frame, and having at least one electrode smaller than said semiconductor chip;
- and
- a resin provided to cover said semiconductor chip,
- a mounting face of said lead frame and a surface of said at least one electrode being exposed to be substantially flush with a plane of said mount surface, and a perimeter of said surface of said at least one electrode being surrounded by said resin.
A semiconductor device comprising:
- a lead frame having a bonding portion and an electrode terminal;
- a semiconductor chip having a first surface, a second surface, and at least one patterned electrode formed on said first surface, said second surface being bonded to said bonding portion of said lead frame;
- and
- a resin provided to cover said semiconductor chip,
- a mounting face of said electrode terminal of said lead frame being provided to be substantially flush with a surface of said at least one patterned electrode,
- the surface of said at least one patterned electrode being exposed to said first surface of said semiconductor chip, and
- a perimeter of said surface of said at least one patterned electrode being covered by said resin.
Dependencies are inferred from the claim text.