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US 6,784,535 B1Granted
Composite lid for land grid array (LGA) flip-chip package assembly
AssigneeTexas Instruments Incorporated
InventorTz-Cheng Chiu
Life of this patent
Estimating the term…
Abstract
A composite lid for a semiconductor package, in which the lid includes at least two materials. The first material is disposed over and attached to the back surface of the die with a low-modulus thermal gel and the second material is disposed towards the perimeter of the lid. The second material has a modulus of elasticity greater than the modulus of elasticity of the first material, and preferably, at least twice that of the first material.
Claims10
An apparatus comprising:
- a composite lid for a semiconductor package, wherein the composite lid comprises:
- a first material;
- and
- a second material, wherein the second material has a modulus of elasticity greater than the modulus of elasticity of the first material.
1 more element
Dependencies are inferred from the claim text.