Semiconductor device

A semiconductor device comprising:

• a first semiconductor package having upper and lower surfaces, said first semiconductor package including a plurality of land terminals on the lower surface;
• a second semiconductor package having a planar configuration substantially the same as that of said first semiconductor package, provided on the upper surface of said first semiconductor package, said second semiconductor package including a plurality of lead terminals extending from a side surface of said second semiconductor package;
• and
• a third semiconductor package having a planar configuration substantially the same as that of said second semiconductor package, provided on said second semiconductor package;
• and
• said second and third semiconductor packages having two pairs of side surfaces opposing to each other,
• wherein the plurality of the lead terminals of said second semiconductor package extend from one pair of the side surfaces, and said third semiconductor package includes a plurality of the lead terminals extending from the other pair of the side surfaces towards directions different from those of one pair of the side surfaces of said second semiconductor package.

A semiconductor device comprising:

• a first semiconductor package having an upper and lower surfaces, said first semiconductor package including a plurality of land terminals on the lower surface;
• and
• a second semiconductor package having a planar configuration substantially the same as that of said first semiconductor package, provided on the upper surface of said first semiconductor package, said second semiconductor package including a plurality of lead terminals extending from a side surface of said second semiconductor package;
• wherein each of the lead terminals extends on and along the lower surface of said first semiconductor package.