Reticle defect printability verification by resist latent image comparison

A system for examining a reticle for defect printability comprising:

• a wafer exposure system comprising a resist wafer, the resist wafer comprising a photoresist layer formed over a substrate, the photoresist layer having at least a first latent image, at least a second latent image, and at least a third latent image printed therein;
• a latent image inspection system operatively connected to the wafer exposure system for examining the printed latent images in order to determine whether a reticle employed to print the latent images is defective, the inspection system comprising a measurement system to facilitate comparing the first, second, and third latent images printed on the photoresist layer;
• and
• a processor for comparing and analyzing data gathered by the inspection system to determine whether at least one of the first, second, and third latent images is defective.

A method for examining defect printability of a reticle comprising:

• providing a resist wafer comprising a photoresist layer, the photoresist layer being the uppermost layer;
• printing a first latent image, a second latent image, and a third latent image on the photoresist layer using a reticle;
• and
• analyzing the first latent image, the second latent image, and the third latent image with respect to one another to determine whether the reticle is defective.