Electronic device with encapsulant of photo-set resin and production process of same
AssigneeCanon Kabushiki Kaisha
InventorMasashi Kitani
Life of this patent
Estimating the term…
Abstract
An electronic device is described which comprises a functional element chip having a photofunctional element formed thereon, a wiring member electrically connected to a terminal of the functional element chip, and an encapsulant for fixing the functional element chip and the wiring member, wherein a light blocking member with an opening portion is provided on a front face side of the wiring member, and wherein an end of the opening portion is located more inside than an inner end of the wiring member.
Claims8
An electronic device comprising a functional element chip having a photofunctional element formed thereon, a wiring member electrically connected to a terminal of the functional element chip, an encapsulant, which is formed of a photo-setting resin, provided so as to cover an electrical connecting portion for connecting the terminal of the functional element chip and the wiring member, and a light blocking member, with an opening portion, provided on a side opposite to the functional element chip side with regard to the wiring member,
- wherein an end portion of the light blocking member is located more toward a center of the functional element chip than is an inner end of the wiring member.
An electronic device comprising a semiconductor chip having an optical semiconductor element formed thereon, a wiring member electrically connected to a terminal of the semiconductor chip, an encapsulant provided so as to cover an electrical connecting portion for connecting the terminal of the semiconductor chip and the wiring member, a light-transmissive protective member and a light blocking member, with an opening portion, provided between a front face of the wiring member and a rear face of the protective member,
- wherein an end of the opening portion is located more inside than an inner end of the wiring member, and
- wherein the encapsulant is a photo-set resin, and the end of the opening portion and an inner end of the encapsulant align.
A process of producing an electronic device comprising a functional element chip with a terminal, a wiring member electrically connected to the terminal, an encapsulant for fixing the functional element chip and the wiring member, and a light-transmissive protective member, the process comprising the steps of:
- disposing a light blocking member with an opening portion between a front face of the wiring member and a rear face of the protective member such that an end of the opening portion is located more inside than an inner end of the wiring member;
- providing a photo-setting resin for forming the encapsulant onto the periphery of a connecting portion between the wiring member and the terminal of the functional element chip;
- and
- irradiating a light from the side of a front face of the protective member through the opening portion of the light blocking member to set at least a part of the photo-setting resin.
Dependencies are inferred from the claim text.