Microelectronic device assemblies having a shielded input and methods for manufacturing and operating such microelectronic device assemblies

A method of manufacturing a microelectronic device assembly, comprising:

• providing a microelectronic die having an integrated circuit and a plurality of bond-pads coupled to the integrated circuit, the bond-pads including a reference voltage (Vref) bond-pad and a signal bond-pad proximate to the Vref bond-pad;
• attaching a support structure to the die, the support structure having a plurality of conductive members each including a first end with a bond-site proximate to a corresponding bond-pad of the die, a second end defining an external connector, and an elongated section connecting the bond-site to the external connector, the conductive members being arranged so that at least a portion of the bond-sites are in a first row and spaced apart from one another by a first gap width, and wherein a first bond-site of a first conductive member is spaced apart from a second bond-site of a second conductive member by a second gap width greater than the first gap width;
• and
• coupling the Vref bond-pad to the first bond-site of the first conductive member and coupling the signal bond-pad to the second bond-site of the second conductive member.

A method of manufacturing a microelectronic device assembly, comprising:

• providing a microelectronic die having an integrated circuit and a plurality of bond-pads coupled to the integrated circuit, the bond-pads including a reference voltage (Vref) bond-pad and a signal bond-pad proximate to the Vref bond-pad;
• attaching a support structure to the die, the support structure having a plurality of conductive members each including a first end with a bond-site proximate to a corresponding bond-pad of the die, a second end defining an external connector, and an elongated section connecting the bond-site to the external connector, the conductive members being arranged so that at least a portion of the bond-sites are in a first row, and wherein the conductive members include a first conductive member, a second conductive member, and a third conductive member, the third conductive member having a shielding section between and adjacent to the first and second conductive members;
• and
• coupling the Vref bond-pad to the first conductive member with a first wire-bond line, coupling the signal bond-pad to the second conductive member with a second wire-bond line, and coupling an electrical potential to the third conductive member.

A method of operating a microelectronic device assembly having a die with a reference voltage (Vref) bond-pad and a signal bond-pad, the Vref bond-pad being adjacent to the signal bond-pad on the die such that a first wire-bond line to the Vref bond-pad is immediately adjacent to a second wire-bond line to the signal bond-pad without an interposing wire-bond line between the first and second wire-bond lines, the method comprising:

• applying a reference voltage to the Vref bond-pad;
• providing a high-frequency signal to the signal bond-pad;
• and
• inhibiting electrical fluctuations generated by providing the high-frequency signal to the signal bond-pad from influencing the reference voltage applied to the Vref bond-pad.

A method of operating a microelectronic device assembly having a die with a reference voltage (Vref) bond-pad and a signal bond-pad, the Vref bond-pad being adjacent to the signal bond-pad on the microelectronic die assembly, the method comprising:

• providing a reference voltage to the Vref bond-pad;
• providing a high-frequency signal to the signal bond-pad;
• and
• shielding a first conductive member coupled to the Vref bond-pad from electrical fluctuations generated in a second conductive member coupled to the signal bond-pad.