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US 6,784,366 B1Granted
Thermal dissipation package for an electrical surface mount component
AssigneeMotorola, Inc.
InventorsEdmund B. Boucher, Harold M. Cook, Jose N. Diaz
Life of this patent
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Abstract
An electronic component (202), such as a power transistor, is formed of a molded plastic package having top (206), bottom (204) and side (208) surfaces and electrical contacts. A lead frame (210) attaches to one of the contacts and wraps about the component (202) so as to provide heat dissipation capability from the bottom and top surfaces of the molded plastic package.
Claims4
A thermal dissipation assembly for an electronic component, comprising:
- a printed circuit board (PCB) having first and second surfaces and soldered filled vias formed therebeween;
- an electrical component having a ground contact;
- a thermal dissipation device formed of a lead frame wrapped about the electronic component, the lead frame coupling to both the ground contact and the first surface of the PCB aligned over the soldered filled vias;
- a heat spreader coupled to the second surface of the PCB and aligned under the solder filled vias;
- a first chassis contacting the metal spreader;
- and
- a second chassis contacting the thermal dissipation device.
4 more elements
Dependencies are inferred from the claim text.