Aromatic polyamide compositions for molding

An aromatic polyamide composition for molding comprising:

• A. 100 parts by weight of a semi-aromatic polyamide in which (a) the quantity of aromatic monomer in the monomer component that forms the polyamide is greater than 20 mol %, said polyamide having (b) a dicarboxylic acid component selected from the group consisting of terephthalic acid, a mixture of terephthalic acid and isophthalic acid in which the quantity of terephthalic acid in the dicarboxylic acid component is greater than 40 mol %, a mixture of terephthalic acid and adipic acid and a mixture of terephthalic acid, isophthalic acid and adipic acid in which the quantity of terephthalic acid in the dicarboxylic acid component is greater than 40 mol %, and (c) a diamine component selected from the group consisting of hexamethylenediamine and a mixture of hexamethylenediamine and 2-methylpentamethylenediamine and (d) a melting point greater than 280° C.;
• and
• B. 5 to 170 parts by weight of wollastonite of a number average length of approximately 5 μm to approximately 180 μm and a number average diameter of approximately 0.1 μm to 15.00 μm and the average aspect ratio of which is greater than 3:1.