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US 6,784,227 B2Granted
Crosslinking base layer for fixing interlinings according to double dot and paste process
AssigneeDegussa AG
InventorsUlrich Simon, Guenther Koehler
Life of this patent
Estimating the term…
Abstract
A microencapsulated adhesive component, comprising a cross-linking constituent microencapsulated with a silanized polybutadiene, wherein the reactive constituent has been first reacted in the melt with cross-linking, thereby resulting in a cross-linkable hot-melt adhesive component for coating and/or laminating surface formations.
Claims19
A microencapsulated adhesive component, comprising:
- a cross-linking constituent microencapsulated with a silanized polybutadiene.
A process, comprising:
- micro-encapsulating a cross-linking constituent in a silanized polybutadiene.
Dependencies are inferred from the claim text.