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US 6,784,120 B2Granted
Method for pretreating a substrate prior to application of a polymeric coat
AssigneeMicron Technology, Inc.
InventorsJohn T. Davlin, Douglas S. Schramm, Lorna M. Mitson
Life of this patent
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Abstract
A method is provided for more efficient application of a polymeric coating (e.g., die coat) to a substrate (e.g., wafer) surface. One aspect of the method comprises applying an organic liquid (e.g., organic solvent) to the wafer and spinning it to coat the entire wafer surface prior to the application of die coat. This reduces surface tension on the wafer and reduces the amount of die coat required to achieve a high quality film.
Claims22
A method of coating a substrate, comprising:
- dispensing at least one organic liquid on a first major surface of the substrate;
- spinning the substrate until the organic liquid is distributed across the substrate surface;
- dispensing a die coat composition on the substrate having organic liquid on its surface, wherein the die coat composition comprises at least one organic solvent;
- and
- spinning the substrate until the die coat composition is distributed across the substrate surface.
2 more elements
A method of coating a substrate, comprising:
- dispensing at least one organic liquid on a first major surface of the substrate;
- spinning the substrate until the organic liquid is distributed across the substrate surface;
- dispensing a die coat composition on the substrate having organic liquid on its surface, wherein the die coat composition comprises an additive selected from the group consisting of photoactive compounds, adhesion promoters, stabilizers, surfactants, and combinations thereof;
- and
- spinning the substrate until the die coat composition is distributed across the substrate surface.
2 more elements
A method of coating a wafer, comprising:
- dispensing at least one organic liquid on a first major surface of the wafer;
- spinning the wafer until the organic liquid is distributed across the wafer surface;
- dispensing a die coat composition on the wafer having solvent on its surface, wherein the die coat composition comprises at least one organic solvent;
- and
- spinning the wafer until the die coat composition is distributed across the wafer surface.
2 more elements
A method of coating a wafer, comprising:
- dispensing at least one organic liquid on a first major surface of the wafer;
- spinning the wafer until the organic liquid is distributed across the wafer surface;
- dispensing a die coat composition on the wafer having solvent on its surface, wherein the die coat composition comprises an additive selected from the group consisting of photoactive compounds, adhesion promoters, stabilizers, surfactants, and combinations thereof;
- and
- spinning the wafer until the die coat composition is distributed across the wafer surface.
2 more elements
A method of coating a wafer, comprising:
- dispensing at least one organic solvent on a first major surface of the wafer;
- spinning the wafer until the solvent is distributed across the wafer surface;
- dispensing a die coat composition on the wafer having solvent on its surface;
- and
- spinning the wafer until the die coat composition is distributed across the wafer surface.
2 more elements
A method of coating a wafer, comprising:
- dispensing at least one organic solvent on a first major surface of the wafer;
- spinning the wafer until the solvent is distributed across the wafer surface;
- dispensing a die coat composition on the wafer having solvent on its surface wherein the die coat composition comprises at least one polymer precursor;
- and
- spinning the wafer until the die coat composition is distributed across the wafer surface.
2 more elements
A method of coating a substrate, comprising:
- dispensing at least one prewet solvent on a first major surface of the substrate;
- spinning the substrate to distribute the prewet solvent across the substrate surface;
- dispensing a die coat composition comprising at least one die coat composition solvent on the first major surface of the substrate having at least one prewet solvent thereon;
- spinning the substrate to distribute the die coat composition across the substrate surface;
- and
- dispensing an edge bead removal composition comprising at least one edge bead removal solvent on a second major surface of the substrate and the edge of the substrate to remove die coat composition present on the second major surface and the edge of the substrate;
- wherein at least one prewet solvent is the same as at least one die coat composition solvent and at least one edge bead removal solvent.
4 more elements
Dependencies are inferred from the claim text.