Semiconductor device and method for manufacturing the same
AssigneeSumitomo Electric Industries, Ltd.
InventorMitsuaki Fujihara
Life of this patent
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Abstract
A semiconductor device includes a lower conductive member, an upper conductive member and a conductive wire. The one end of the conductive wire is electrically connected to a semiconductor chip. The lower conductive member is formed on a lead frame. The conductive wire is sandwiched between the lower conductive member and the upper conductive member located thereon and is electrically connected to the lead frame. A connecting portion of the conductive wire connected to the lead frame is sandwiched between the lower and upper conductive members so that the neck portion of the conductive wire can be protected from above.
Claims2
A method for manufacturing a semiconductor device in which a semiconductor chip and a wiring member are electrically connected to each other, comprising:
- forming a lower conductive member on said wiring member;
- connecting the one end of a conductive wire to said semiconductor chip;
- connecting said conductive wire to said lower conductive member;
- forming an upper conductive member on said lower conductive member through said conductive wire;
- and
- after forming the upper conductive member on said lower conductive member, bonding a conductive portion extending from said upper conductive member to said wiring member at a different position from said lower conductive member.
A method for manufacturing a semiconductor device in which a semiconductor chip and an electrically conductive wiring member are electrically connected to each other, said electrically conductive wiring member being electrically isolated from said semiconductor chip, comprising:
- forming a lower conductive member on said electrically conductive wiring member;
- connecting the one end of a conductive wire to said semiconductor chip;
- connecting said conductive wire to said lower conductive member;
- forming an upper conductive member on said lower conductive member through said conductive wire;
- and
- prior to connecting the one end of the conductive wire to said semiconductor chip, bonding a conductive portion extending from said lower conductive member to said electrically conductive wiring member at a different position from said lower conductive member.
Dependencies are inferred from the claim text.