Semiconductor package with a die attach adhesive having silane functionality
AssigneeNational Starch and Chemical Investment Holding Corporation
InventorOsama M. Musa
Life of this patent
Estimating the term…
Abstract
This invention relates to a semiconductor package in which a silicon die is adhered to a substrate with an adhesive comprising a resin having the structure: in which Q is an oligomeric or polymeric group containing at least one carbon to carbon double bond, A is a hydrocarbyl group or an aromatic group, and L is a linking group resulting from the reaction of a functional group, excluding epoxy, on the precursor for the segment containing silane and a functional group, excluding epoxy, on the precursor for the segment containing the at least one carbon to carbon double bond.
Claims8
A semiconductor package in which a silicon die is adhered to a substrate with a die attach adhesive formulation comprising
- (a) a resin having a segment containing silane and a segment containing at least one carbon to carbon double bond in which the resin has the structure
- in which
- (i) Q is an oligomeric or polymeric group containing at least one carbon to carbon double bond,
- (ii) n is simultaneously for each position 0, 1, or 2;
- (iii) R1 is a methyl or ethyl group;
- (iv) R2 is a vinyl group, an aromatic group, or a linear or branched alkyl group of 1 to 4 carbon atoms;
- (v) A is a hydrocarbyl group or an aromatic group;
- (vi) L is a linking group resulting from the reaction of a functional group, excluding epoxy, on the precursor for the segment containing silane and a functional group, excluding epoxy, on the precursor for the segment containing the at least one carbon to carbon double bond;
- (b) a curing agent;
- (c) optionally, a filler.
Dependencies are inferred from the claim text.