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US 6,784,024 B2Granted
Die attach curing method for semiconductor device
AssigneeMicron Technology, Inc.
InventorTongbi Jiang
Life of this patent
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Abstract
A low temperature cure adhesive material for affixing a solder mask to a die is described. The adhesive material is at least partially cured at temperatures below about 100° C. The low temperature curing lowers the thermal stresses on the adhesive, diminishes the possibility of voids being formed in the adhesive material, and increases the bond yield.
Claims13
A method of making a semiconductor device comprising:
- affixing a solder mask directly to a semiconductor die using an adhesive layer;
- partially curing said adhesive layer by exposing said adhesive layer to a temperature no greater than 100° C.;
- and after said partially curing
- executing further package assembly processes prior to fully curing said adhesive layer.
1 more element
Dependencies are inferred from the claim text.