Solid-state imaging device
AssigneeSony Corporation
InventorKouichi Tanigawa
Life of this patent
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Abstract
A process for producing a solid-state imaging device which includes the steps of forming a light-receiving portion of a pixel in a surface region on the substrate, forming above the light receiving portion an inter-layer dielectric having a depression in its surface, forming on the inter-layer dielectric a light transmitting film having in its surface a concave conforming to the depression, forming at the position that covers the concave on the light transmitting film a mask layer with a convexly curved surface, and etching the mask layer and the light transmitting film all together, thereby making the light transmitting film into a shape of convex lens with an upwardly curved surface.
Claims5
An improved process for producing a solid-state imaging device comprising the steps of:
- forming a light-receiving portion of a pixel in a region of a substrate, forming a convex lens with an upwardly curved surface which is embedded in an inter-layer dielectric above said light-receiving portion, and forming an on-chip lens above said convex lens, wherein said improvement comprises forming sequentially said light-receiving portion, forming an inter-layer dielectric having a depression in its surface above said light-receiving portion, forming on said inter-layer dielectric a light transmitting film having in its surface a concave portion conforming to said depression, forming at a position that covers said concave portion on said light transmitting film a mask layer with a convexly curved surface without etching or planarizing the light transmitting film, and etching said mask layer and said light transmitting film all together, thereby making said light transmitting film into a lens.
Dependencies are inferred from the claim text.