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AssigneeAir Products and Chemicals, Inc.
InventorsRalph J. Ciotti, Scott Edward Beck, Eugene Joseph Karwacki, Jr.
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A process is described for depositing a copper film on a substrate surface by chemical vapor deposition of a copper precursor. The process includes treating a diffusion barrier layer surface and/or a deposited film with an adhesion-promoting agent and annealing the copper film to the substrate. Suitable adhesion-promoting agents include, e.g., organic halides, such as methylene chloride, diatomic chlorine, diatomic bromine, diatomic iodine, HCl, HBr and HI. Processes of the invention provide copper-based films, wherein a texture of the copper-based films is predominantly (111). Such films provide substrates having enhanced adhesion between the diffusion barrier layer underlying the (111) film and the copper overlying the (111) film.
A composition comprising a mixture of a copper precursor comprising hexafluoroacetylacetonate and an adhesion promoting agent comprising at least one member selected from the group consisting of an organic halide, HCl, HBr, HI, Cl2, Br2 and I2.
A composition comprising a copper precursor and an adhesion promoting agent wherein the adhesion promoting agent comprises one or more halogen compounds and is substantially free of fluorine, wherein the copper precursor comprises a fluorinated organometallic compound.
A composition for the chemical vapor deposition of a copper film, the composition comprising:
Dependencies are inferred from the claim text.